Semiconductors in 2025Equipment ImportsIndustry New Trends

As the global semiconductor industry accelerates its transition to sub-3nm processes, the latest data from China Customs shows a 37% year-on-year increase in imports of precision etching machines from January to June 2025, but the return rate rose by 12 percentage points. Current import processes exhibit three key characteristics:

• Technology Restrictions Escalation: The Wassenaar Arrangement 2025 revision added controls on five categories of lithography machine components
• Tariff Structure Optimization: Provisional import duty rates for equipment under HS code 8542 reduced to 5%
• Inspection Standards Refinement: Customs Announcement No. 37 specifies radiation protection testing standards for wafer transfer systems

Common Operational Mistakes and Cost Analysis

In March 2025, a wafer fab incurred 47 days of port detention for $230 million worth of deposition equipment due to classification errors, resulting in additional storage fees of 3.8 million yuan. Such cases reveal three typical mistakes:

• Mistake 1: Self-handling Licenses
  • Confusing the application scope between Key Used Mechanical and Electrical Products License and Automatic Import License
  • Overlooking dual-use declaration requirements for EUV lithography machines
• Mistake 2: Single Price Comparison Procurement
  • Failing to calculate compliance costs under U.S. EAR export control regulations
  • Omitting ASML equipment-specific technical maintenance clauses
• Mistake 3: Neglecting After-sales Service Binding
  • 90% of return cases involve unregistered third-party maintenance services
  • Hitachi assembly equipment must match original factory calibration certificates

The value realization path of professional agency services

Comparison between a memory chip manufacturers self-import and agency service data:

• Time Cost: Customs clearance period reduced from 58 days to 22 days
• Risk Control: Compliance defect rate dropped from 43% to 6%
• Professional support: Comprehensive tax rate decreased by 2.7 percentage points

Practical guide to customs clearance operations

For 2025s latest regulatory requirements, we recommend building a three-step defense system:

• Pre - classification stage
  • Utilize customs classification precedent databases to compare adjudication cases from recent three years
  • Pay special attention to the 9012/8428 classification dispute for wafer transfer robots
• Document preparation stage
  • Japanese manufacturers must provide copies of METI export licenses
  • Korean equipment requires KTL-certified EMC test reports
• On - site inspection stage
  • Prepare original vacuum chamber pressure test data in advance
  • Temperature and humidity recorder models compliant with General Administration of Customs requirements

Agency selection strategy

Four capability identification criteria for high-quality agents:

• From the perspective of qualifications: Possess AA-class customs declaration qualification with hazardous materials transportation filing
• Industry experience: Have handled at least 3 complete import projects for 12-inch wafer fabs
• Service network: Maintain emergency response centers in Rotterdam, Yokohama, and San Francisco
• Response speed: Provide 7×24 technical document pre-review services

When importing thin-film deposition equipment valued over $5 million, professional agency services can reduce unforeseen costs by 18%-25%. Companies are advised to engage compliance consultants during supplier screening to establish a comprehensive risk control system spanning from commercial negotiations to equipment acceptance.